Heat Sink Paste High Temperature Conductivity 300°C

Thermal paste is a very high 300°C heat conductive paste- that is used between two objects (usually a heat sink and a CPU/processors/Peltier) to get better heat conduction. Thermal Paste Is Also Called as CPU Heat Sink Paste / Heat Paste. Heat Sink Compound / Heat Sink Paste / Thermal Gel / Thermal Interface Material or Thermal Paste is a kind of Thermally Conductive paste used between IC and Heatsink.

Feature:

• this paste is basically a thermally conductive material.
• this paste used as an interface between the heat sink and heat sources.
• this paste can be used in high-power semiconductor devices.
• this heat sink grease or paste is used to fill the space and all imperfections on the heat sink.
• it has the capability of withholding 300-degree centigrade.
• this heat sink paste is Non- toxic.
• it has high-temperature conductivity.
• it saves the loss of heat which causes the loss in the heat sink’s performance.